As AI servers shift toward 48V architectures, brick power modules are evolving into the "heart" of computing power. This technical review analyzes eight modules from 15W to 1300W, highlighting how digital control and LLC topologies are driving the industry toward higher efficiency and PUE optimization.
In the high-power segment, Flex sets a benchmark with 97.7% efficiency and digital telemetry in its 1300W quarter-brick series. ZTE focuses on density with a stacked 800W half-brick design, while HUAWEI emphasizes reliability, combining TI digital ICs with advanced thermal fin structures for mission-critical 12V rails.
For compact and specialized needs, Delta and Ericsson lead in lightweight (10-30g) isolation modules for medical and IBC scenarios. GE utilizes aluminum substrates to push the thermal limits of its 350W half-brick units. SUPLET targets harsh environments, using metal potting to ensure stable performance in automotive and industrial applications.
For hardware engineers, Modern brick modules are a masterclass in synchronous rectification and thermal management. In the AI era, efficiency and digital integration are the true deciders of system stability, far outweighing simple power ratings.
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