Standard fans are too bulky for today’s foldable phones and AR gear. Realmagic Semiconductor is solving this with a piezoelectric cooling system that uses ceramic vibrations instead of spinning blades. At just 1.83mm thick and 2.7g, it’s a silent, motor-free alternative that fits where traditional fans can't, offering a high-tech solution for the next generation of ultra-thin hardware.
The system is powered by the RM7200B SoC and RM7011A H-bridge. The RM7200B is the "brain," using built-in MCU and impedance scanning to track the pump's status in real-time, keeping the ceramic vibration perfectly stable. Meanwhile, the RM7011A handles the heavy lifting, supporting up to 36V while using smart current limiting to keep the driver itself from getting hot.
Efficiency is the standout feature here. On a 5V supply, the entire setup pulls just 0.71W at full blast—and a tiny 0.043W on standby. This means you get active air cooling that won't kill your battery. For mobile devices, it’s a win-win: better thermal management without sacrificing hours of usage time.
By integrating complex algorithms directly into the chip, Realmagic has made piezoelectric tech "plug-and-play" for manufacturers. The small QFN/DFN packaging and ultra-slim profile make it easy to drop into everything from smart glasses to industrial robots. As devices get thinner, this sub-1W cooling module is positioned to become the new industrial benchmark for compact thermal design.
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